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SINOMER®PM839 is a transparent liquid polymer curing agent with thiol (-SH) termination. Excellent properties when combined with amines or polyamines to cure epoxy resins.
Capcure 3-800;GABEPRO GPM-800;Polythiol QE-340M;Thiocure 1200
72244-98-5
25 or 220 kg/ drum
12000~14000
≤20
SINEPOXY® CA-HC1090 EL is a high-purity, heat-initiated cationic curing agent manufactured for epoxy-based electronic coatings, inks, and adhesives.
Hexafluoroantimonate blocked amine salt
Heat-Initiated Cationic Epoxy Curing
White powder
90 °C (for cycloaliphatic epoxy)
SINEPOXY® CA-HC1080 EL is a heat-initiated cationic epoxy curing agent manufactured as an alternative to K-PURE® CXC-1612 for electronic coatings and adhesives with low-shrinkage agent offering fast initiation at 80°C for cycloaliphatic epoxy resins.
Hexafluoroantimonate blocked amine salt
Heat-Initiated Cationic Epoxy Curing
White powder
80 °C (for cycloaliphatic epoxy)
SINEPOXY® CER-108 OXT (CAS 298695-60-0) is a monofunctional oxetane monomer manufactured as a low viscosity diluent for cationic UV-curable inks and coatings.
3-Ethyl-3-[[(2-ethylhexyl)oxy]methyl]oxetane
298695-60-0
97%Min
25,200kg/ drum
SINEPOXY® CER-221 OXT is a bifunctional oxetane monomer manufactured as an alternative to Aron OXT-221 and Curalite OxPlus for fast, low-shrinkage cationic UV curing.
3,3'-(Oxybis(methylene))bis(3-ethyloxetane)
18934-00-4
99%Min
25,200kg/ drum
Sinepoxy® CA-DICY EL (CAS 461-58-5) is a high-purity electronic grade dicyandiamide manufactured for PCB epoxy laminates and food packaging coatings. This 99.8% pure curing agent meets stringent metal ion requirements for critical electronic applications.
Electronic Grade Dicyandiamide,Cyanoguanidine
≥99.8
White powder
Sinepoxy® CA-DICY IG (CAS 461-58-5) is a high-purity dicyandiamide manufactured as an intermediate for pharmaceuticals, pesticides, and epoxy laminates. This industry-grade product is also used in fertilizers and flame retardants
Dicyandiamide,Cyanoguanidine
≥99.5
White powder
Sinepoxy AA-160 is a latent accelerator that can reduce curing temperature and shorten reaction time.
Latent Epoxy Curing Accelerator
≥95.0
223.1
