Sinomer® UVD 52001 DCM is a dual-cure epoxy methacrylate oligomer containing one epoxy group and one methacrylate double bond in the same molecule. This unique structure enables two independent curing mechanisms: free-radical UV polymerization through the methacrylate group, and cationic or thermal ring-opening polymerization through the epoxy group. The dual-cure capability allows for shadow-area curing, post-curing, and enhanced crosslink density, making it suitable for demanding adhesive, coating, ink, and sealant applications. It exhibits high reactivity, excellent chemical resistance, high hardness, and good abrasion resistance.
