*CAS 13188-82-4 | Molecular Formula: C₉H₁₄O₄ | MW: 186.20 g/mol*
IPGA is a key acrylate monomer engineered for UV-curable systems. Its unique molecular structure delivers:
Ultra-Low Viscosity: 4.09 mPa·s at 25°C (smoother than water)
Enhanced Reactivity: Accelerates curing kinetics by >30% vs. standard acrylates
Subzero Flexibility: Tg = -7°C maintains elasticity in cryogenic environments
1. Photopolymerization Catalyst
When formulated into UV resins, IPGA reduces curing time by ≥30% while achieving nanometer-scale surface smoothness. Ideal for:
High-precision 3D printing (0.01mm resolution)
Screen printing inks
Optical coatings
2. Universal Adhesion Promoter
Blends with polyurethane resins (30% loading) enable 100% adhesion on glass/aluminum substrates. Critical for:
Automotive sealants
Pressure-sensitive adhesives
Aerospace composites
3. Environmental Resistance
Molecular design provides exceptional:
UV stability (ASTM G154 certified)
Thermal endurance (continuous 110°C service)
Radiation shielding (3× improvement in vacuum environments)
IPGA synthesis exemplifies green chemistry principles:
| Step | Innovation | Benefit |
|---|---|---|
| Feedstock | Bio-based glycerol replaces petrochemicals | 30% lower carbon footprint |
| Catalysis | Acid-base synergistic system | 45% energy reduction (80°C/atm pressure) |
| Purification | Molecular distillation + crystallization | 99.5% purity (impurities <0.01%) |
3D Manufacturing
Consumer Electronics: Printed smartphone frames/watch housings (CNC alternative)
Aerospace: Liquid nitrogen-compatible composites (-196°C toughness retention)
Flexible Electronics
Wearables: 500% elongation elastomers for e-skin/smart bands
Foldable Displays: 60% crease reduction in OLED encapsulation
Space Tech: Radiation-hardened circuit boards (lunar/mission-ready)
Request:
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